Chipmaker Nvidia seeks to raise over $25B in first bond deal since 2021
Posted in
業界新聞
Chipmaker Nvidia seeks to raise over $25B in first bond deal since 2021
Debt sale set to test investor appetite for further exposure to AI sector amid a deluge of borrowing. https://arstechnica.com/ai/2026/06/chipmaker-nvidia-seeks-to-raise-over-25b-in-first-bond-deal-since-2021/?utm_brand=arstechnica&utm_social-type=owned&utm_source=mastodon&utm_medium=social
Chipmaker Nvidia seeks to raise over $25B in first bond deal since 2021
Debt sale set to test investor appetite for further exposure to AI sector amid a deluge of borrowing.
arstechnica.com
Comments (0)